Self-Assembly for Nanomanufacturing of Hybrid Nanodevices

Prof. Seunghun Hong

Dept. of Physics, Seoul National University, Korea

2005. 5. 18

 
Recent dramatic progress of nanotechnology and biological science allows us to combine soft materials (e.g. biomolecules, self-assembled monolayer etc.) with solid nanostructures (e.g. nanoparticles, carbon nanotubes, electronic circuits etc.) to build a generation of new hybrid nanoscale devices such as molecular electronic circuits, nanoscale biological sensors, and protein motor-based nanomechanical systems. However, a major stumbling block for their industrial applications is a difficulty in high throughput assembly for device fabrication. One promising nano-manufacturing method for these hybrid devices is the surface-templated assembly process. In this strategy, direct deposition methods such as dip-pen nanolithography[1] are utilized to functionalize the desired solid substrate area with organic molecules, and nanostructures (e.g. nanoparticles [2], carbon nanotubes [3], proteins etc.) in the solution are specifically assembled onto the functionalized area via self-assembly mechanism. In this presentation, I will discuss about: 1) self-assembly-based nano-manufacturing methods for hybrid nano-devices and 2) new scientific issues related with hybrid nanostructures. Future prospect and possible applications of hybrid devices also will be discussed.

References

1. S. Hong and C. A. Mirkin Science 288, 1808 (2000).

2. X. Liu, L. Fu, S. Hong, V. P. Dravid, and C. A. Mirkin Advanced Materials 14, 231 (2002).

3. S. Rao, L. Huang, W. Setyawan, and S. Hong, Nature 425, 36-37 (2003)

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Last update: May 18, 2005