Self-Assembly for Nanomanufacturing of Hybrid
Nanodevices Prof.
Seunghun Hong
Dept. of
Physics, Seoul National University, Korea
2005. 5. 18
Recent
dramatic progress of nanotechnology and biological science allows
us to combine soft
materials (e.g. biomolecules, self-assembled monolayer
etc.) with solid nanostructures (e.g. nanoparticles, carbon nanotubes, electronic
circuits etc.) to build a generation of new hybrid nanoscale devices such as molecular electronic circuits, nanoscale biological sensors, and protein
motor-based nanomechanical systems. However, a
major stumbling block for their industrial applications is a difficulty in high
throughput assembly for
device fabrication. One promising
nano-manufacturing method for these hybrid devices is the surface-templated
assembly process. In this strategy, direct deposition methods such as dip-pen nanolithography[1] are utilized to functionalize the desired solid substrate area with
organic molecules, and nanostructures (e.g. nanoparticles [2], carbon
nanotubes [3], proteins etc.) in the solution are specifically assembled onto the
functionalized area via self-assembly mechanism. In this presentation, I
will discuss about: 1) self-assembly-based nano-manufacturing methods for
hybrid nano-devices and 2) new scientific issues related with hybrid
nanostructures. Future
prospect and possible applications of hybrid devices also will be discussed.
References
1. S. Hong and C. A. Mirkin Science 288, 1808 (2000).
2. X. Liu, L. Fu, S. Hong, V.
P. Dravid, and C. A. Mirkin Advanced
Materials 14, 231 (2002).
3. S. Rao, L. Huang,
W. Setyawan, and S. Hong, Nature 425,
36-37 (2003)
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